The authors present the results of experiments to determine the empirical control rules needed in the control of the dispensing of the small quantities of adhesives used to secure surface mount components to mixed technology printed circuit boards before wave soldering. Rule representations needed to control the dispensing system and to adapt elements of its behavior to changes in material property parameters are discussed. The authors also describe the implementation of a diagnostic system operating on a pressure-time pulse from the dispensing equipment. This system is a part of the controller that is needed for the dispensing system and the manufacturing cell in which it is contained. The cell and a control system that is currently under construction are also presented.